3D photonic chip module. Credit: Keren Bergman Artificial intelligence (AI) systems promise transformative advancements, yet their growth has been limited by energy inefficiencies and bottlenecks in data transfer. Researchers at Columbia Engineering have unveiled a groundbreaking solution: a 3D photonic-electronic platform that achieves unprecedented energy efficiency and bandwidth density, paving the way for next-generation AI hardware. The study, "3D Pho